We carried out plating thickness and composition analysis on dual-layer NiP/Au plating on Cu contacts on a flexible printed circuit using a 蓝鲸体育直播 X-ray analytical microscope. We successfully detected Au of ultra-thin layer without any sample preparation. The thickness results of Au and NiP plating were consistent with the provided values and with good repeatability.
X-ray Analytical Microscope (Micro-XRF)
X-ray Analytical Microscope
with a Super Large Chamber
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