External Dimension
GR-300 Series
Wafer Back Side Cooling System
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.
The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
- Pressure control with more stability and accuracy
- Mass flow sensor (Option)
- Compatible for various fitting
- RoHS compliance
Application example
In the below example, the GR-300 Series is controling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.
