Plating film thickness measurement of printed circuit board wiring

Semiconductors

Plating film thickness measurement of printed circuit board wiring

Wire plating film thickness measurement of tens of μm width

It is possible to perform non-destructive analysis of the multilayer film thickness of interconnects with a width of several tens of micrometers on the order of sub-micrometers.

Microscopic X-ray analyzer XGT-9000 Pro/Expert

Simple elemental analysis with no pre-treatment required and non-destructive
Introducing a new model equipped with an X-ray detector that can measure boron (B)
Quickly access measurement points with high-definition optical observation even in minute areas
A wide variety of image analysis software is also available.

XGT-9000

X-ray Analytical Microscope (Micro-XRF)

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Fast analysis of microscopic metal particles is an important application for engineering (e.g. engine wear analysis). Micro-XRF scanning and spot analysis of specific fragments identifies their chemical composition.

We carried out plating thickness and composition analysis on dual-layer NiP/Au plating on Cu contacts on a flexible printed circuit using a 蓝鲸体育直播 X-ray analytical microscope. We successfully detected Au of ultra-thin layer without any sample preparation. The thickness results of Au and NiP plating were consistent with the provided values and with good repeatability.

Our XGT-9000SL allows failure analysis at a microscopic level on a large sample, non-destructively, thanks to its large chamber capacity and its microprobes.

μ-XRF is a non-destructive analytical technique which can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays. This application note introduces failure analysis to detect ion migration, voids, and foreign matter on electronics using the XGT-9000, with key features of the vertical irradiation of a 10 μm probe and the simultaneous imaging of fluorescent X-rays and transmission X-rays.