The penetrating nature of EDXRF analysis allows multi-layered samples to be characterised with a single measurement. With high spatial resolution even microscopic features such as bonding pads on circuit boards can be interrogated for composition and layer thickness.
Schematic of the XGT5000 configuration and x-ray beam penetration.
校 胁邪褋 械褋褌褜 胁芯锌褉芯褋褘 懈谢懈 锌芯卸械谢邪薪懈褟? 袠褋锌芯谢褜蟹褍泄褌械 褝褌褍 褎芯褉屑褍, 褔褌芯斜褘 褋胁褟蟹邪褌褜褋褟 褋 薪邪褕懈屑懈 褋锌械褑懈邪谢懈褋褌邪屑懈.
