蓝鲸体育直播

LEM Series

Camera Endpoint Monitor based on Real Time Laser Interferometry

鞁れ嫓臧 霠堨澊鞝 臧勳劖瓿 旮半皹 LEM Series Camera Endpoint Monitor 雼轨偓鞚 鞁れ嫓臧 臧勳劖瓿 頂勲靹胳姢 氇媹韯半姅 鞁濌皝/歃濎癌 瓿检爼鞐愳劀 頃勲 霊愱粯鞕 韸鸽爩旃 旯婌澊毳 鞝曤皜頃橁矊 臧愳頃╇媹雼.
鞖╇弰鞐 霐半澕 LEM 旃措⿺霛检棎電 670, 905 霕愲姅 980nm 霠堨澊鞝臧 韽暔霅橃柎 鞛堨溂氅 鞗澊韻检潣 靸侂嫧鞚 歆侅爲 氤挫澊電 霌滊澕鞚 鞐愳箻/歃濎癌 頂勲靹胳姢 毂旊矂鞐 鞛レ癌頃橂┐ 靸橅攲 響滊┐鞐 鞛戩潃 霠堨澊鞝 鞀ろ専鞚 靸濎劚霅╇媹雼. 雼儔甏戩澊 靸橅攲 響滊┐鞐 雼快溂氅 臧勳劖鞚 氚滌儩頃橃棳 頃勲鞚 霊愱粯 氚 雴掛澊 氤頇旊 鞚疙暣 甏戫暀 瓴诫 旮胳澊臧 雼る雼堧嫟.
鞚措ゼ 韱淀暣 鞁濌皝/歃濎癌 靻嶋弰 氚 霊愱粯毳 鞁れ嫓臧勳溂搿 氇媹韯半頃 靾 鞛堨溂氅, 旃挫毚韺 霕愲姅 氤措嫟 氤奠灐頃 攵勳劃鞚 靾橅枆頃橃棳 雼れ枒頃 頂勲靹胳姢鞐 雽頃 頄レ儊霅 頂勲靹胳姢 鞝滌柎 Endpoint毳 鞝滉车頃╇媹雼. 霕愴暅 鞚疙劙韼橃澊鞀る姅 氚橃偓鞙 氤頇旍棎 鞚橅暣 韮愳霅 靾 鞛堨姷雼堧嫟.

Segment: Semiconductor
Manufacturing Company: 蓝鲸体育直播 France SAS

General features

Based on the interferometry technique, LEM camera is ideally suited to etch/deposition rate monitoring, Fringes counting and endpoint detection, providing high precision detection of film thickness and trench depth and also interfaces.
The LEM camera can be mounted on any process chamber with direct top view of the wafer and provides a real-time digital CCD image of the sample surface making spot positioning simple.


Figure 1: Camera image makes spot positioning simple

General features

  • Multi-Configurations to fit your needs
    LEM Camera is available with:
    • 2 configurations :
      • LEM Sensor
        • simple analog output,
        • ideal for OEMs (sensor only)
      • LEM-CT complete instrument
        • includes full computer control (Sigma_P software) powered by an easy to use recipe editor for advanced process monitoring. Ideal for OEMs and process development in industrial R&D environments.
    • 3 types of lasers compatible with a broad range of films including SiN, SiO2, GaAs, InP, AlGaAs, GaN鈥 LEM camera uses visible (670 nm) or NIR laser (905, 980 nm) depending on applications
    • XY manual or motorized stage
    • Perpendicularity Tilt management on the LEM sock (default) or using an easier tilt function (optional)
       
  • Sensor head: Camera with CCD imaging
    A large objective lens to wafer distance attachment range of 200 mm to 800 mm. The use of lasers enables a spot diameter as small as 20 碌m to 100 碌m. A compact, self-contained amplifier design that allows simple monitoring of 0 V to 10 V outputs with only a camera if connected to devices such as a data logger.
    This system calculates the etching/deposition speed of the monitored area by monitoring the interference intensity based on the cycle, leading to detection of the end-point from the prescribed film thickness and trench depth.
    Based on this theory, this system is extremely stable and can be used with complex multi-layer films.
     
  • Frame grabber
    The frame grabber permits to optimize camera setup position and also to set the spot on the right location for process monitoring.
     
  • Traditional interference wave type
    The horizontal axe represents time. An interference cycle is generated with respect to the etching depth as the etching process progresses. The amount of etching during one cycle is displayed as Thickness/Depth = 位 (laser wavelength) / 2n (refractive index of etching film).

     
  • Sigma_P for real-Time Monitoring and Endpoint
    厂颈驳尘补冲笔漏 software allows rapidly configuring recipe and then creating robust endpoint detection:
    • Using Windows 10 based Software platform, intuitive user interaction permits to deal with Laser wavelength along time.
    • A simple Recipe Editor allows the user to build efficient recipes, signal arithmetic and filtering, plus Endpoint condition(s) and decision(s), using a Formula Editor, with help online integrated.
    • Up to 8 curves can be displayed on the same screen to monitor Signal, derivative plus specific Interferometric Method variables & Endpoint at the same time.
       
  • Recipe Management
    Unified concept permits to setup recipes in a fluent and user-friendly Excel-like Recipe Editor.
    With Sigma_P software expansion settings feature, many compatible algorithms for special signal detection and detection of signals with poor S/N ratios are included and can always be expanded.
     
  • SQL Management
    Chamber Database, Tool Databases are embedded close to the sensor and accessible online, by operator, by recipes, by statisticians, by APC servers, by distant process engineer office.
     
  • Reprocessing Manager to playback raw data
    To allow instant replay of mathematical treatment for instrumentation optimization but also scripted automatic reprocessing of multiple data runs for process validation, APC extensions, parametric studies.
    This data can also be sent directly to 蓝鲸体育直播 for analysis and optimization.
     
  • Active Recipe Manager
    Extensions allow data exchange Run to Run, Wafer to Wafer, Lot to Lot, Chamber to Chamber for enhanced production control
     
  • Statistical Process Control in situ
    Statistic engine allowing recipes to self-compute production metrics, default values, triggered by direct user but also from host or engineer desk

     
  • Automation Data Link Manager
    Design flexibility to interface chambers, equipment mainframes, fab hosts, fab servers using middlewares: Remote Control (RS 232, TCP/IP, PIO), SECS, HSMS, Fab LAN, Fab e-mailing, and other protocols
     
  • Advanced Algorithm Manager
    Combination of powerful external math tools to the native recipe math formula editor and in situ math calculator
     
  • Kinetic Modeler for Interferometric engineering
    Theoretical Interferometric curve according to piling structure (each layer is characterized by its material, thickness, and Etch/deposition rate) and Wavelength used. It permits to obtain reference curve before real engineering on wafers

     
  • Options
    • XY stage 2 models: Manual or motorized (with Controller and Joystick)
    • Manual Tilt to ease perpendicularity setup (FA labs)
    • PC Controller 2 models: Standard or High Grade
       
  • Attachment conditions
    A measurement view port of 酶20 or greater will be required in a vertical direction across the wafer.

 

LEM-CT Applications

Generality

Regarding Interferometry (Laser or Multiwavelength using broad Flash Lamp source), endpoint detection mostly consists in three steps:

  1. selection of the relevant wavelengths that carry the information about the transition (interface detection) or thickness/depth/remaining thickness
  2. a real-time data filtering (in the broad sense) and the construction of an endpoint indicator,
  3. a series of tests to confront the algorithm to the reality of production fluctuations.

To address these new requirements, 蓝鲸体育直播 has developed a unique generation of Sensor (Hardware and Software), based on interferometry, for Endpoint, fault detection and Advanced Process Control (APC) adaptable to all etchers, to help engineers and Fab鈥檚 to manage actual and future products and technologies.

Interferometry: INT

LEM-CT for Real-Time accurate and reliable Thickness/depth information

Besides plasma, Sample information is also complex. LEM-CT (as EV 2.0 INT),mounted on any process chamber with direct top view of the wafer,allows to obtain local information on optically semi-transparent, multi-layers structure. This allows the etch rate and thus etched thickness to be monitored in real time, providing enhanced process control for a wide variety of processes. Additionally, interfaces can be detected by their change in reflectivity.

Based on the interferometry technique, LEM-CT is ideally suited to etch/deposition rate monitoring and endpoint detection, providing high precision detection of Fringes counting, film thickness, trench depth, interfaces鈥

  • Interference occurs when monochromatic light hits the sample surface, resulting in different optical path lengths due to film thickness and height variations in the film.
  • 蓝鲸体育直播 is providing WIN10 PRO, 64bits PC with 蓝鲸体育直播 Software dedicated to interferometric monitoring and endpoint

LEM

System outlineLEM camera consists of a compact interference measurement section that includes the laser source, light receiver, and optical components, as well as the illumination and CCD imaging camera, allowing monitoring of any area of the wafer surface using microscopic images.
Light sourceLaser diode
Light source wavelengths670 nm, 905 nm, 980 nm
Magnification50x (G50) or 120x (G120)
Spot diameter20 渭m to 100 渭m,
depending on camera to wafer distance
DetectorPin-photo diode
Camera Dimensions65 (W) 脳 160 (H) 脳 100 (D) mm
2.6 (W) 脳 6.3 (H) 脳 3.9 (D) in
(camera only, excluding stage)
Camera mass1.2 kg, 2.6 lb
RemoteLEM-CT only may be connected to any host through digital Link with RJ 45 connector: TCP/IP.
An optional SEQ70 box contains an interface board to provide galvanic isolation between the host controller hardware of the HOST / Tool from the box main electronics
Label onDescriptionPlug type
RemotePIO, RS, analog 0-5VFemale DB25
This permits to communicate by logic wiring, fast, deterministic with full optocouplers and power spikes isolation, frequently found in industrial fab environment
LEM SIGNAL BOXLEM-CT only is provided with a LEM Signal BOX connected in USB on the PC to collect:
  • Frame grabber
  • LEM signal
CertificationCE


Windows 10 PRO, 64bits PC Controller

DC Power Supply24V
SSD256 Go, 2,5鈥 SATAIII
DesignAluminum Frame, fanless design
Anti-vibration and shock resistant
ConnectionRS-232/422/485
RS-232
USB 3.0 on Standard
2x RJ45 Gb
VGA, HDMI
Standard PC (Default)
CPU64bits, Intel庐 Pentium庐 N4200, 2.5 GHz
RAM4Go DDR3
Controller Dimensions197 (W) x 110 (D) x 55 (H) mm
Controller Mass2 kg
High Grade PC (Optional)
CPU64bits, Intel庐 Core鈩 i7-7700T 2,9 GHz
RAM8Go DDR4 2133MHz
Controller Dimensions264 (W) x 96.4 (D) x 186.2 (H) mm
Controller Mass4.5 kg


Option

Manual XY stage
Manual XY stage Travel range卤8.0尘尘
Manual XY Stage dimensions120 (W) 脳 120 (H) 脳 87 (D) mm
4.7 (W) x 4.7 (H) x 3.4 (D) in
Manual XY Stage Mass1.3 kg, 2.8 lb
Motorized XY stage
Motorized XY stage Travel range卤12.5尘尘
Motorized Stage dimensions167 (W) 脳 117 (H) 脳 112 (D) mm
6.6 (W) 脳 4.6 (H) 脳 4.4 (D) in
Motorized Stage Mass2.6 kg, 5.6 lb
Software
  • LEM-CT: Sigma_P, Kinetic Modeler for Engineering & Production
  • LEM: Analog sensor, no software
Accessories for SEQ70-PIO box and PC
  • Direct connection on tool 24 VDC
    • <1A, 20W for SEQ70 box
    • <4A, 80W for PC
  • External power supply AC 100-240V->24VDC, 5A
  • HDMI Screen, Mouse, keyboard
Various Configurations
  • EV 2.0 + LEM camera for dual-sensor monitoring on one chamber


Environmental

Operating Temp/humidity罢别尘辫锛18鈩冿綖50鈩
Humidity锛0锝70锛匯H銆锛圢o dew condensation锛
Transportation Temp/humidity罢别尘辫锛-20鈩冿綖55鈩
Humidity锛0锝70锛匯H銆锛圢o dew condensation锛
Metal Organic Chemical Vapor Deposition (MOCVD)
Metal Organic Chemical Vapor Deposition (MOCVD)
The MOCVD process is a recognized controllable synthesis method that uses a variety of precursors like Trimethyl Indium (TMI) and Diethyl Zinc (DEZ) that require a robust delivery method to ensure process repeatability and high yield.

鞝滍拡 氍胳潣

蓝鲸体育直播鞝滍拡鞚 鞛愳劯頃 鞝曤炒毳 鞗愴晿鞁滊┐, 鞎勲灅鞚 鞏戩嫕鞐 雮挫毄鞚 鞛呺牓鞚 攵韮侂摐毽诫媹雼.

* 電 頃勳垬鞛呺牓頃鞛呺媹雼.

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