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Semiconductors

Foreign matter removal device on wafers

Automatic foreign matter removal device using blow & vacuum suction

100% of the 10μm standard glass beads are removed (5 stuck foreign particles remain). Foreign matter attached to the wafer is automatically removed by air (or N2) blowing and vacuum suction. À¶¾¨ÌåÓýÖ±²¥ can  handle up to a wafer size of 200 mm.

PD10
PD10

Reticle / Mask Particle Detection System

RP-1
RP-1

Reticle/Mask Particle Remover

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