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The PR-PD series can detect foreign substances that are difficult to detect with the built-in exposure machine detector. When targeting wafers, it is possible to measure foreign particles on bare wafers with a maximum sensitivity of 0.1 渭m.

• Foreign material elemental analysis of defective parts on SiC wafers
  • Identification of foreign elements that cause defects on SiC wafers
• Foreign matter analysis on wafers in a wide range
  • Analyzing foreign objects within a few square centimeters
• Plating film thickness measurement of printed circuit board wiring
  • Wire plating film thickness measurement of tens of 渭m width
• Reticle/mask foreign object detection
  • High-throughput foreign object detection
• Foreign matter removal device on wafers
  • Automatic foreign matter removal device using blow & vacuum suction